Development Status of Sintering of Silver Particles of Different Scales
DOI:
https://doi.org/10.54097/ewwq1j30Keywords:
Silver sintering; Die-attachment; review.Abstract
Power devices developed based on emerging wide bandgap semiconductors have higher requirements for packaging materials, which need to be able to work in more demanding environments. Silver particle sintered materials could be sintered at lower temperatures, work at higher temperatures, and have excellent electrical and mechanical properties, meeting the requirements of new power devices. This article conducts a thorough analysis of the preparation of raw materials, sintering methods, and product properties for sintering silver particles of different sizes through a search of relevant literature. Combined with the current market requirements for packaging materials, the advantages, current problems, and future development trends of sintering silver particles at the nanometer, micrometer, and micro nano composite levels are explored, providing reference for further research and application of silver particle sintering.
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