Preface: 8th International Conference on Chemical Engineering and Advanced Materials (CEAM 2025)

Authors

  • Willie Thackeray Metropolitan Autonomous University, Mexico
  • Jie Li Lanzhou University of Technology, China

DOI:

https://doi.org/10.54097/53kpg559

Abstract

The 2025 8th International Conference on Chemical Engineering and Advanced Materials (CEAM 2025) was held in Philadelphia, USA during September 20-21, 2025. This conference aims to provide opportunities for all participants to exchange new innovative ideas and application experiences as well as to provide a platform where possible innovators can think of new ventures, generate contacts and networks for future collaboration.

The CEAM 2025 topics include chemical engineering, biological chemistry, biological pharmacy, food science, chemical materials, nano materials, materials processing engineering, and advanced materials applications. This conference brought together leaders from industry and academia to exchange and share their experiences, present research results, explore collaborations, and to spark new ideas, with the aim of developing new projects and exploiting new technology.

On behalf of the conference organizers, we would like to thank the reviewers for their time and effort in reviewing the papers. Their feedbacks to the authors have been excellent and useful to ensure high quality papers for the conference. Our appreciation to all keynote speakers for sharing their thoughts and experiences with respect to various topics. Our sincere thanks also go to all attendees from all around the world for participating in the conference. Finally, we would like to thank the organizing committee members for their hard work, cooperation, and insights in ensuring the success of this conference.

Scientific Committee of CEAM 2025

Philadelphia, USA

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Published

26-09-2025

How to Cite

Thackeray, W., & Li, J. (2025). Preface: 8th International Conference on Chemical Engineering and Advanced Materials (CEAM 2025). Highlights in Science, Engineering and Technology, 157, I. https://doi.org/10.54097/53kpg559