Review Application of Low-Temperature Copper Sintering in New Energy Vehicle Power Devices
DOI:
https://doi.org/10.54097/wa348r21Keywords:
Copper sintering; die-attachment, review.Abstract
The growing demand for reliable and efficient power electronics in new energy vehicles (NEVs) has driven the development of advanced packaging solutions. This study examines three copper sintering techniques, micro-sized, nano-sized, and bimodal hybrid sintering, as alternatives to conventional soldering methods. Micro-sized sintering offers cost advantages and process stability but requires high pressures for effective bonding. Nano-sized sintering enables superior joint strength and densification at lower temperatures but faces challenges in scalability and oxidation control. Bimodal sintering presents a balanced approach, combining the benefits of both micro- and nano-sized particles to achieve robust interconnects without excessive costs. By analyzing the mechanisms and trade-offs of each method, this research provides insights into optimizing copper sintering for high-performance NEV power modules, supporting the transition toward sustainable and durable packaging solutions.
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