FENG, Xinrui. Interface Barrier Technologies in Advanced Semiconductor Interconnect Metals and Their Reliability Impact: The Evolution from Cu to Co/Ru. Highlights in Science, Engineering and Technology, [S. l.], v. 164, p. 13–22, 2026. DOI: 10.54097/tqk6gf59. Disponível em: https://hsetdata.net/index.php/ojs/article/view/39. Acesso em: 30 jul. 2026.